Electronic miniaturization and increasing requirements on fiber reinforced structures in the aerospace and transportation industries continue to push operating temperature requirements higher. Epiclon HP 4770 offers a solution to that challenge while also providing high modulus/stiffness, low water absorption, improved mechanical properties, adhesion and good fiber wet out—all critical factors to success in applications ranging from printed circuit boards, encapsulants and lightweighting for aerospace and automobile applications.
Epiclon HP 4770 is well suited for prepreg manufacturing, adhesives, molding compounds, pultrusion and resin infusion and has no restrictions from important regulations, such as the Toxic Substances Control Act in the United States or Reach in Europe.
“Our customers are looking for resins that can significantly boost the glass transition temperature of advanced materials structures,” said Mark Edwards, Global Key Account Manager of Epoxy, Composites & Fiber Sizing, Sun Chemical Advanced Materials. “Our new Epiclon HP 4770 takes the temperature performance to a new level. Synthesis of the new epoxy resin yielded the desired results our customers are looking for and confirmed that the critical compressive strength of a structure is related to the resin modulus. The naphthalene unit ratio is key to this strength as well as functionality control. It is an exciting push forward for our customers.”
Companies: Sun Chemical