These novel epoxy adhesive systems exhibit high levels of thermal conductivity (between 3 and 6 W/mK), combined with excellent mechanical, adhesive and outgassing performance. Most significantly these properties are achieved with cured resin densities as low as 40% that of competitive conductive adhesives on the market. AGM’s TP 300/400 products are therefore highly versatile, while providing end users with significant savings in both mass and cost.
Already being adopted within the industry, AGM’s TP 300/400 systems are ideal for use where thermal management is critical in structural bonding or gap filling, across a range of satellite and general space applications.
TP300/400 adhesives are supplied in 2 pack resin and hardener systems. They are supported by an extended performance database, available on short lead-times and supplied in convenient kit sizes to suit customer requirements.
Companies: Applied Graphene