These products are targeted for a range of Fifth Generation (5G) applications such as chip encapsulation, underfill, molding compounds, mm Wave base station infrastructure (both for digital and RF signal) for smartphones, high layer count Printed Circuit Board (PCB) servers, routers for “cloud computing “ and semiconductor packaging. These resins are specifically designed for use in devices enabling innovative next generation 5G technologies like Advanced Driver Assistance Systems (ADAS).
Due to their extremely low moisture absorption and other chemical resistances at high temperatures and high frequency, these products are suitable for various demanding aerospace applications where Ultra-Low dielectric, low moisture properties and high Tg are essential. Various aerospace processes such as resin infusion, hot melt prepreg, Filament Winding (FW) and other liquid processes can be adapted due to low and stable viscosity.
Novoset officials said:
“We are pleased to collaborate with Shin -Etsu Chemical, Japan to commercialize these unique products to address material gaps and difficult-to- process current 5G materials (targeted to mm Wave substrates, Antennas) such as Liquid -Crystal Polymers (LCP), Polyimides (PI) and Polytetrafluorethylene (PTFE). Shin-Etsu Chemical is our ideal collaborator due to their in-house 5G applications and global footprint in semiconductors and other high-end industries”.
The resins are developed at Novoset Technology Center in Berkeley Heights, NJ (USA).
Under this Agreement, Shin-Etsu Chemical Co., Ltd. will manufacture the resins globally in the relevant electronics industries and market the products under SLK name. Novoset will market the products in Aerospace, Oil & Gas and other industries and continue to improve and expand the range of products according to market needs.
The details of each new 5G-related Shin-Etsu product are as follows:
1) Quartz Cloth (Product name: SQX Series)
It has immensely superior characteristics concerning transmission loss (degree of degradation of the electrical signal), such as a Dk (dielectric constant) of less than 3.7, a Df (dissipation factor) of less than 0.001, and a linear expansion coefficient of less than 1ppm/°C. Its low-loss capabilities are most suitable for applications such as a circuit board’s core material to provide key support for next-generation 5G requirements for very high-speed communications materials, and it also demonstrates its vastly superior characteristics for antennas and radar domes’ fiber-reinforced plastic parts material.
The Quartz Cloth consists of very thin quartz threads, whose thickness can be made even under 20μm, and it can match the new demand for thinner laminated circuit boards. In addition, quartz has the characteristic of having very few occurrences of α-rays and it can prevent the malfunctioning of devices due to radiation rays.
2) Thermoset Ultra-Low Dielectric Resin (Product name: SLK Series)
This product has low dielectric characteristics close to those of fluorocarbon resins as well as high strength and high elasticity. The lowest level dielectric properties with a dielectric constant of less than 2.5 in the high-frequency band (10～80GHz) and a dielectric dissipation factor of less than 0.0025 are achieved by this thermoset resin. Because it has the properties of low moisture uptake and high adhesive strength to low profile copper (low roughness copper foils) as well, it is suitable for usage in such areas as FCCL (flexible copper clad laminates) and as an adhesive agent.
They are also planning to develop low dielectric encapsulant materials and low dielectric high-thermal conductivity adhesives.
Shin-Etsu has reached a license agreement with Novoset, LLC regarding ultra low-loss dielectric resin with high-temperature resistance and very low moisture absorbency. Adding these products to their product line-up will strengthen their market position in CCL (copper-clad laminates), rigid laminated circuit boards (multilayer IC substrates), antennas and radar domes for communication base stations that require high heat resistance and reliability.
3) Heat Dissipation Sheet (Product name: SAHF Series)
In order to meet increasing market demand for 5G, they have relaunched newly developed sticky sheet products onto the market, sheet that is combined with heat dissipation material and a hot melting adhesive sheet. Shin-Etsu’s products offer a wide range of thermal conductivity from 5W/mK to 100W/mK, making them very suitable in applications for power semiconductors and automotive fields where high reliability is required.