may, 2020

13mayAll Day15Adhesion & Joining Expo Osaka 2020Exhibition of Bonding and Bonding Technologies

Event Details

The show gathers advanced adhesive and joining technologies for automobile, electronics, construction, etc. It is held twice a year in Osaka and Tokyo.

Time

may 13 (Wednesday) - 15 (Friday)

Location

Japan, Osaka, Intex Osaka

Intex Osaka

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